Laser micromachining

  • The custom developed micromachining station consists of a precise 3D positioning gantry system (Standa, LT) mounted on a granite structure.
  • Integrated femtosecond laser system Jasper X0 (Fluence technology) with 1st and 2nd harmonics.
  • High-power laser parameters: pulse duration 300 fs – 20 ps, output power up to 40 W, pulse on demand up to 2 MHz, repetition rate up to 20 MHz.
  • Travel ranges of 120 × 120 × 100 mm, with resolution of ±500 nm in XY direction and 1 μm in Z direction.
  • For handling workpieces, there is a ceramic vacuum chuck option for dimensions up to 4-inch wafers.

Capable Technologies

  • Selective laser etching
  • Thin film microablation
  • Laser welding
  • Refractive index change

Applications

  • Micromachining of transparent materials
  • Microfluidics
  • Microoptics
  • Integrated optics
  • Lab-on-chip devices

Micromachining Setup

Micromachining station side view with researcher
Micromachining station close-up view
Micromachining station front view

NIST, Wheel trap

Wheel trap chip manufactured by selective laser etching.

Planar Paul trap

Planar Paul trap with 3D segments manufactured by selective laser etching.

Ross's trap microfabricated structure