Laser micromachining
- The custom developed micromachining station consists of a precise 3D positioning gantry system (Standa, LT) mounted on a granite structure.
- Integrated femtosecond laser system Jasper X0 (Fluence technology) with 1st and 2nd harmonics.
- High-power laser parameters: pulse duration 300 fs – 20 ps, output power up to 40 W, pulse on demand up to 2 MHz, repetition rate up to 20 MHz.
- Travel ranges of 120 × 120 × 100 mm, with resolution of ±500 nm in XY direction and 1 μm in Z direction.
- For handling workpieces, there is a ceramic vacuum chuck option for dimensions up to 4-inch wafers.
Capable Technologies
- Selective laser etching
- Thin film microablation
- Laser welding
- Refractive index change
Applications
- Micromachining of transparent materials
- Microfluidics
- Microoptics
- Integrated optics
- Lab-on-chip devices
Micromachining Setup
NIST, Wheel trap
Wheel trap chip manufactured by selective laser etching.
Planar Paul trap
Planar Paul trap with 3D segments manufactured by selective laser etching.